v0.4.0

• Swap fill on bottom layer to be 3.3V not Ground
• Replace RTC with DIP package due to availability
• Increase size of electrolytic capacitor footprint, to better suit size of common parts
• Replaced VGA connector - in-stock ones have the pins set back from the board edge

v0.3.0

• Adds via stitching around the edge of the board

v0.3.0-rc1

RC1 for 0.3.0.

v0.2.0

• First complete PCB layout

Release v0.2.0-rc3

RC3 for v0.2.0

Release v0.2.0-rc2

RC2 for v0.2.0

Release v0.2.0-rc1

RC for v0.2.0

Release v0.1.0-retry1

Retrying v0.1.0 build